Mts Appendix - mE tri+is
A. SPCHIEBAEE (Statistical Process Control)
HPSHSA CTQ (Critical to Quality) Was: SERBIA (APEHIE 245 +/- 5 °C SEKI, Cpk = 1.67, iS#EREAARE(Cpk > 1.33), AAS 12,800 MAGES, FERBHHEAIBR(UCL/LCDNWS HA.
CTQSH =» MU (Spec) #5{(Mean) tr (Sigma) Cp Cpk HE
GRE 245 +/-5 °C 244.8 °C 1.02 °C 163 | 1.67 | Ae 2eeE 120+/-15um | 119.2um 4.3 um 1.16 | 1.12 | Se MA aEeX 0 +/-50 um 2.1 um 12.8 um 1.30 | 1.25 ats NGA WREeY 0 +/- 50 um -1.8 um 14.2 um 1.17 1.13 KE ICTREYE EER +/-5% | 0.12% (fia 1.23% 135 | 131 | Ais THAME «=| 350 +/-20mA | 348.5 mA 5.8 mA 115 | 1.06 | @&
B. #4. RamParetos#tf (Defect Pareto)
AA BARRE 316+, ARE 0.79%, FRR RASHHERP: BENS (Solder Joint)
9844(31.0%), 7ct4+UaF(Component Shift) 6744(21.2%), #atF(Solder Bridge) A5{4#(14.2%), tRMA(Missing Part) 38/4(12.0%), tkMEBz(Polarity Reverse) 29/4(9.2%), Exits 39((12.3%).
RI=AARAIT AL 66.5%, Came: BIE - ALE TUSRE HAP rofile; stews - BHRNozzleRlE HREM A TULA, Bai - CCM (Stencil) FFOikit, HIBAZALAD-pad,
C. (EMS SiFS (Supplier Quality Score)
{RRS ae RK ABIK Bias FR Samsung SDI Fite 24 24 100.0% A TDK MLCCHRES 36 35 97.2% B+ YageoH|E FBBA 48 48 100.0% A Sunwodahxati& BMS##8 12 11 91.7% B Kingboard%#iz PCB 18 18 100.0% A
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DeltaQik
FRR
8
87.5%
DeltaBiABiR RRA RA
nF PRSRER EGER < TSNAUBSER). AHA RSeY TEPSTBIEAI(SCAR), BRIS L/FAARISSDIRE.