docs/Kailh Socket.pdf — Cherry Mx Breakout Board datasheet

[ f ABIDE BY ROHS (m Specification :

@1. Rating: Voltage :12V AC/DC max.,2V DC min. Current: 10mA AC/DC max.,10yA DC min. @2. Contact Resistance : 100mQ Max @3. Insulation Resistance :100MQ at 500V

— | @4. Withstand Voltage : AC100V (50-60Hz)

for 1 minute 11.30£0.15 @5.Mation Force : 3. Okgf max 14.50+0.15

@6. Operating Life :100 Cycles N

0.60+0.1

SECTION C—C

(2.55)

3.05+0.05

6.35+0.1 1.80+0.05

1.68+0.1

6.35

5.89+0.1

PCB LAYOUT

10.90+0.1

1.20+0.1 _ __1.20+0.1

APPROVALS DATE y CONGGUAN CITY KAIHUA ELECTRONICS CO.,LTD

[DRAWN | huyuanfeng 2016-04-11 |xaih

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Document Number:

KAIHUA EELETRONICS K H-PS1607- 10

Kailh Poo ia Product Specification P/N: Title : PG151101S11 1511 Connector

Rev. ECN Nene Prepared By /Date: | Checked By/Date: Approved By/Date:

A _— New releasing #J/A47 | 7 42/2016/03/15 | iiazcW4/2016/03/15 42 /2016/03/15

B —____ Revise format (8 #tst | 3 #e4 2016/9/20 iio 2016/9/20 FZ 2016/9/20

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R wu Product S ification a a+ p=

P/N: DOC. No.: Rev.: Page: Kailh PG151101S11 KH-PS 1607-10

KAIHUA EELETRONICS

1. SCOPO/YE HE: ec eececcceseseseseseeteeeseseseseseseseseseseneseseseseseseseseseseseseseseneseseneseseseseseneseseneaeseseaeseseneaeneneas 3 2. ProductA pplication/?* 440774 :

3. Technology Parameters/FX7t Bz

4. Ratings/#ie PEREBEK..w

5. Profile Dimensions /4U Rf

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R ws Product Specification dy sll aE me + P/N: DOC. No.: :

Revi Kailh a PG151101$11 KH-PS1607-10

1. Scope/¥i:

This Product Specification covers the requirement of Mechanical keyboard Connector switch on product performance, test methods and quality assurance provisions. ASSURE FS PS Ae att WL BIE RAP SER, LEE RET Tha. WNT AE Be oe AE TY TE.

2. Product A pplication/;** YA:

Mainly applied on computer keyboards,cash registers equipment and Man-Machine interface. ESSE SH, BARWL, bbe ALE 3. Technology Parameters/KRFAM

Ambient Humidity (FW RE: 45~95% R.H.; Operating Temperature Range (i Hifi yu Hl: -10°C~+60°C; Storage Temperature Range (x (Fifi Eve Hl: -20°C~+70; Normal Condition: Ambient temperature 443534 : 20+2°C Relative humidity #Ax}¥E RE: 85% +5% R.H.; Air pressure “(k: 86~101KPa; Contact Resistance #é fit BH dit: 200 m2 Max; Solder Ability Hy VE: 245+5°C,3+0.5s; Withstand Soldering Temperature fli t# 2244: 260+5C,5+1s; 4. Ratings/Aie HERES Rating Voltare #2 HUSK: 12V AC/DC max; 2V DC min Rating Current #ilze Hii 10mA AC/DC max; 10uA DC min InsulationResistance 442% HHH: 2100M Q/DC 500V; Withstand Voltage ifiy Hi Hs: AC 100V_ 1 Minute; Mechanical Life HLA ft: 100Cycles (No lead). 5. Profile Dimensions /44 JZ Rf 3.520.058 1.80+0.05 + o ir | Ue] =| Le 10.90+0.1 :

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Kailh

aL 3

KAIHUA EELETRONICS

Product

P/N: PG151101S11

DOC. No.: KH-PS 1607-10

Specification

6. Electrical Performance/i MERE

an era Test Condition WinA te Requirement HK BEE Static load: (Operation force)x2, which is applied on the center of Switch stem. PASH: SITE 2 i. Tate Fwd. Contact 100mQ Max 6.1 | Resistance | Measurement tool: Contact resistance Meter. 100mQ LF Pe fide HEBEL We LL pice iit eesti Ha BALL KHz, 20mV,5~50mA) Apply a Voltage of DC 500 V for 1 minute, according to the below method. (1) Between terminals. Insulation (2) Between terminal and Body. 100MQ Min 6.2 | Resistance 7 ; : oo 100 JKRKRLAE da ede HE EL fA 500V DC HAJ 1 oer, deo F Pefih IE Wik: (1) sin Sig FZ. Ta. (2) si Sb sEZ A. Apply a Voltage of AC 100 V (50~60HZ) for 1 minute, according to the below method. Dielectric (1) Between terminals. | 2) Between terminal and Body. 63 withstanding (2) y No evinence of t age fA LOOV AC HUSK 1 4-H}, Het FBO | SewRNR. aa. wees ja: (1) sia Sy sig F ZT. (2) sia Fb SCZ TAY. 7. Mechanical Performance/f)AKLERE It D ipti . . he Paha Test Condition winAee Requirement #M Es 7,1 | Mating force At 16in/minute.actuation speed Mating force

fhHAD

ffiAH 3KG max

" Confidential "

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R ws Product Specification dy 1] | 3 ca Ff P/N: DOC. No.: Rev.: Page:

Kailh sa PG151101S11 —_|KH-PS1607-10 B - Unmating U ine £ 72 force At 16in/minute.actuation speed Jnmat ing orce Huy PtH 100gf min Measured by according to the below condition: (1) Acceleration: 80g dx EE (2) Cycles of test:3 cycles each in 6 directions, for a total of 18 cycles. Shock AIK: FED TT I 3K, 6 AT FE 18 XK. Appearance: 7.3 Sor te / No abnormality. Ry eure | y - STG (1) No load Hak Contact resistance: (2) Mating force: Maximum value of 200 m2 Max operation force. PEARLS: 200 SERRLA FE 74 Life Test TAT: BRE OURS ELI) ERR. Bouncing: 10ms Max Ar arWWiX — | (3) Cycles: 100 Min ERE RAL: 100 KE 8. Environmental Performance/}{i= p+ 2 Pa oh ak Test Condition wlikA fF Requirement se BE (1) Temperature : - 20+2°C WihRE: - 2042°C (2) Duration of test: 48h Contact resistance: 8.1 |e epeEIT A: 48 ANIKh 200m2 Max FO HE (3) Take off a drop water J: KBE eft BA. 200m 2 LIK (4) Standard conditions after test: 1h AS a CARE: 1 ZI

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Product Specification

DOC. No.: Rev.: Page: Kalth KAIHUA EELETRONICS PG151101S11 KH-PS1607-10 B 6/9 (1) Temperature: 7042°C Contact resistance: Wi: 7O+2°C 200m2 Max Heat test (2) Duration of test: 48h Shall meet: 8.2 | gst RAEI TA]: 48 /) thy No. 6.2 ; (3) Take off a drop water J=fii7k¥& efi EB 200mQ2 LAF (4) Standard conditions after test: 1h TAL: RAMA: 1 NI No. 6.2 (1) Test cycles:20 cycles Contact resistance: Age al: 5 NASH 200mM2 Max (2) Standard condition after test:1h Shall meet : Temperature TARA ES 1 bt No. 6.2 8.3 | cycle Temperature | Duration of test PE fo HBA 200M QL ii A sheer ann i fs Leycle [2025° Th No. 6.2 at 20+5T 1h HH sec Th 70+5T 1h Soldering area: T/2 of PWB thickness. (PWB: T=1.6mm) PETAR: EX Mn SEMI 1/2 JE Eb Soldering Soldering temperature: 260+5°C Appearance: 8.4 | heattest Soldering time: 3-0.5s No abnormality. TN Ee JEBIA RE: 260+5°C Sh TCS wegen TAl: 340.5 1. Hand soldering F432: Please practice according to below condition: (1) Soldering Temperature: 350+5°C JERE RE, 350-45°C Atleast 90% of surface g.5 | S0lderability | (2) Continual soldering time: 3:0.5s oorton shall be covered | AGE EARN TH]: 30.5 pb ; an by solder. (3) Capacity of soldering iron: <20w (2 TAR KF 90% LIE. HI PRINE: 20 PLLA 2. Automatic Reflow soldering AZylAlvitHe: For the product of SMT, according to below condition:

" Confidential "

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2a Tt

Product Specification

P/N: DOC. No.: Rev.: Page: Kallh KAIHUA EELETRONICS PG151101S11 KH-PS1607-10 B 719 SMT [li th Ew 2 BE mC) (8. 260°C Max, 3 sec Max. 20 Peak temperature / | eet | 180 / | 150 | 1.2-3.50/s | | } wl | PCB EIA] | = | 120sMax | 40s Max | fae "RB BE . RAG BRE ARE (1) Temperature : 602°C Contact resistance: Whe: 60+2°C 200m2 Max (2) relative humidity: 90~95% R.H. Shall meet : FATE :90~95% RH. No. 6.2 Humidity (3) Duration of test: 48h Bef HBA 200mM2 LAF 8.6 | test SEACIYTA: 48 7) it WAL! TREE (4) Take off a drop water No. 6.2 ZPPATR (5) Standard conditions after test: 1h WIC APE: 1 7h Apply the following environment to test: Appearance: HEH BUA ESET T UK: No corrosion spot, no crack, no base plate (1) Temperature: 352+5°C naked. Wn RE: 355°C; SPM: TOW, TORS, 37 Salt Spray | (2) Salt water density: 5+1% TOPRIM. | HESS MUA #hKIRRE: 5+1%; (3) Duration: 12 hours Eee I [A]: 12 /NIN; Contact Resistance: (4) After test, the salt deposit shall be 200 m2 Max removed by running water. fev HABA: 200 SERRLAF Seer ak ERT kh a " Confidential "

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P/N: Kailh KAIHUA EELETRONICS PG151101S11

R Product S ification aL te TF pees

KH-PS1607-10 B 8/9

Apply the following environment to test: HEH FU AAP HEFT MK

(1) Temperature: 35+5°Ci#iJE: 3545°C Withstand (2) K2S Density: 2%;

8.8 | K2S GARE: 2%

Bi MU ik (3) Duration: 2 minute.

PAE Ta]: 2 4-H

Appearance:

No corrosion spot, no crack, no base plate naked.

SW: TCR, FCARAL, TERR BIE

Contact Resistance: 500 m2 Max Pefi FG: 500 SERRLA FE

9. Recommended PCB Layout #£74hy PCB 288 SES

(Top View) (Single face board T=1.6mm)

(2.55)

PCB LAYOUT 10. Packaging 32

Packaging type: 13Tray, 26000P cs/Carton. Be 77 A138 AE, 26000P cs/#i.

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P/N: DOC. No.: Rev.: Page: Kailh KAIHUA EELETRONICS PG151101S11 KH-PS 1607-10 B 9/9 | 11.Precaution FR 11.1 Soldering condition FRR AE ITEM CONDITION SHA SME Heating zone Speed<2°C/S, Preheating time15 S Max,temperture150°C Fria BREE<2°C/S, FRPMITTA 15S te % ht 150°C Preheating zone Heatpreservati Speed1. 2~3.5°C/S, Preheating time120 S Max,temperture180°C HUA on area SRE 1.2~3.5°C/S, FINI 1205 me Ae 180°C trim K Fast heating zone | Speed3.5~4.5°C/S, Preheating time140 S Max,temperture230°C Pee Fath TRE 3.5~4.5°C/S, JUNI 1405 SSPE 230°C Weld area Welding time 40 S Max ,welding temperature peak value, 3 sec Max] Bie xX WERE] 40 S ee, ERE SUEIE 260°C kxK,3 Sine Area of flux 1/2 Max of PWB Thickness He Al AR Ei FEL ET 1/2 DAY Temperature of solder 260+5°C Eiri SE 260+5°C Number of soldering 2time Max (But should down heat of the first soldering) TEBE 2A Printed wiring board Single side copper-clad laminates EYL Ail SE AS PT 9A

(1) After reflow, be careful not to clean switches with solvent ARE EBA EA RH AK. (2) Under the condition of using soldering iron, soldering temperature shall be 350°C max within 3 sec.

ERA BAVIR TS , GRE ME350°CUT, FEME3IMAN.

11.2 Notes JERR

(1) Please be cautious not to give excessive static load connector. EBA RMB Aa ED RRR (2) Connector be careful not to stack up P. W. B. after switches were soldered. ERE GED DBRT ESM.

(3) Preservation under high temperature and high humidity or corrosive gas should be avoided Especially. When you need to preserve for a long period, do not open the carton. RENAAMESET SSRN AR AANA ME KNAARE BREA ORE.

(4) Products meet the ROHS & REACH environmental management substances control standards GAA ROHS & REACH SHAS alin ee

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