STF202-22T1G
USB Filter with ESD Protection
This device is designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. It is intended for ON Semiconductor® use in upstream USB ports, Cellular phones, Wireless equipment and
computer applications. This device offers an integrated solution in a http://onsemi.com small package (TSOP—6, Case 318G) reducing PCB space and cost.
Features: CIRCUIT DESCRIPTION
© Provides USB Line Termination, Filtering and ESD Protection GND D(OUT) D(OUT)
@ Single IC Offers Cost Savings by Replacing 3 Resistors, 2 Capacitors, and 5 TVs diodes
e Bi-directional EMI Filtering Prevents Noise from Entering/Leaving the System
© IEC61000—4—2 ESD Protection for USB Port
© Flexible Pull-down or Pull—up Line Termination to Meet USB 1.1 Low Speed and High Speed Specification
e ESD Ratings: Machine Model = C
Human Body Model = 3B
© This is a Pb-Free Device
Benefits:
e@ TSOP-6 Package Minimizes PCB Space
e Integrated Circuit Increases System Reliability versus Discrete Component Implementation
© TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic case ain G
Inductances STYLE 8 Typical Applications: MARKING DIAGRAM © USB Hubs 65 4 © Computer Peripherals Using USB nn MAXIMUM RATINGS (Ta = 25°C) oe Me
Rating Symbol Value Unit
Steady State Power Pp 225 mw 1 2 3
Maximum Junction Temperature (max) 125 °C ven = Bpecifc Device Code = Date Code
Operating Temperature Range Ty -55 to +125 °C . = Pb-Free Package Storage Temperature Range Tetg —-55 to +125 °C (Note: Microdot may be in either location) 260 °C
Lead Solder Temperature L (10 second duration) ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum +
Ratings are stress ratings only. Functional operation above the Recommended Device Package Shipping
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability. STF202-22T1G | TSOP-6 | 3000/Tape & Reel
(Pb-Free) tFor information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012 1 Publication Order Number:
September, 2012 - Rev. 9 STF202-22T1/D
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ELECTRICAL CHARACTERISTICS (Ty = 25°C)
STF202-22T1G
Max IR Ver@ | @Vawm | Max Ip . : : 1mA =5.25V | @Vawn | Typical Line Series Resistor Pull-up Resistor (Volts) Veusto | =3.3V | Capacitance |__ Rs (®) (Note 1) Rup (k2) Device | Vawm GND /O Pin (pF) Device Marking | (Volts) | Min | Max (HA) (uA) (Notes 2,3) | Min | Nom | Max | Min | Nom | Max STF202-22T1G $22 5.25 6.0 | 8.0 5.0 1.0 68 20 22 24 1.35 | 1.5 | 1.65 1. For other Rg values (i.e. Rg = 30 ) contact your local ON Semiconductor sales representative. 2. Measured at 25°C, Vp = 0 V, f= 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded. 3. For other capacitance values contact your local ON Semiconductor sales representative. TYPICAL CHARACTERISTICS 10 50 0 40 -~10 P =-25 dBm 30 P = -25 dBm 20 Vde = 0 V 20 Vde = 0 V -30 10 8 -40 8 0 -50 -10 -60 -20 -70 -30 -80 ’, -40 -90 -50 0.1 1 10 100 1000 0.1 1 10 100 1000 (MHz) (MHz) Figure 1. Analog Cross-talk (D+ to D-) Figure 2. Insertion Loss Characteristics 22.2 1540 Rg_ TARGET 1530 22.0 TARGET 1520 21.8 _ 1510 aD Q E E 1500 6 21.6 oy Do eal 490 fia fad 21.4 1480 1470 21.2 1460 21.0 1450
-30-20-10 0 10 20 30 40 50 60 70 80
TEMPERATURE (°C)
Figure 3. Rg versus Temperature
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Figure 4. Rup versus Temperature
-30-20-10 0 10 20 30 40 50 60 70 80 TEMPERATURE (°C)
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STF202-22T1G
APPLICATIONS BACKGROUND
What Is USB?
The USB is not a serial port, it is a serial bus, a fact that enables a single port on the computer to be a link for a myriad of devices, (up to 127 devices in a USB system). We can easily chain one device to another and use one port as a connecting point of many devices by using a hub. All these enables us to look at the USB system as a small network of devices.
SCANNER
The Universal Serial Bus (USB) makes connecting devices to your computer faster, easier and virtually limitless. High-Speed USB devices are capable of communicating at speeds up to 12 megabits without shutting down and without having to open your computer.
| MONITOR | TELEPHONE |
COMPUTER PG CPU
PLOTTER
PRINTER
KEYBOARD
Figure 5. Typical USB System
Typically the USB system consists of one host, hubs and devices.
The Host in the USB system, is responsible to the whole complexity of the protocol (simplifies the designing of USB devices). The host controls the media access, therefore, no one can access the bus unless it got an approval required from the host.
The Hub provides an interconnect point, which enables many devices to connect to a single USB port. The logical topology of the USB is a star structure, all the devices are connected (logically) directly to the host. It is totally transparent to the device what is its hub tier (the number of hubs the data has to flow through). The hub is connected to the USB host in the upstream direction (data flows “up” to the host) and is connected to the USB device in the downstream direction (data flows “down” from the host to the device). The hub’s main functionality is the responsibility of detecting an attachment and detachment of devices, handling the power management for devices that are bus-powered (get power from the bus), and responsibility for bus error detection and recovery. Another important role of the hub is to manage both full and low speed devices. When a device is attached to the system the hub detects the speed, which the device operates in, and through the whole communication on the bus prevents from full speed traffic to reach low speed device and vice versa — prevent from low speed traffic to reach full speed device.
The Device is defined as everything in the USB system, which is not a host (including hubs). A device provides one
or more USB functions. Most of the devices provide only one function but there may be some, which provides more than one and called compound devices. We refer to two kinds of devices — self powered or bus powered devices. A device that gets its power from the bus is called bus powered and on the other hand a device which supplies its own power is called self powered. There are two kinds of devices:
Full-speed devices — operates in 12 Mb/s Low-speed devices that work in 1.5 Mb/s
STF202 Device Information
The Universal Serial Bus (USB) specification revision 1.1 requires EMI Filtering and line termination for the USB I/O lines. The STF202 device from ON Semiconductor provides upstream termination, EMI Filtering and ESD Protection to IEC61000—4—2 (Level 4) in an integrated solution placed in a small and single package (TSOP-6, Case 318G). The equivalent circuit of this device is shown in the Figure 6.
Figure 6.
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STF202-22T1G
As previously mentioned, there are two types of configurations for the USB port which are upstream and downstream. If your port connects to the host either in a direct way or through a hub, you are upstream (data flows “up” to the host) and in the other hand, if you are the host or your port provides access to the host then you are downstream (data flows “down” from the host to the device). In the case of the STF202 device, it provides upstream termination. The Figure 7 represents the termination for an upstream USB port.
Figure 7.
The USB Line termination is reached through the series resistors placed in the D+ and D- lines. These resistors insure the proper termination to maintain the integrity of the signal. The Pull up Resistor of 1.5 kQ on either the D+ or D- data lines is used to identify the equipment as either full-speed or low-speed device.
Connection for Full-Speed and Low-Speed Devices As mentioned before, there are two kinds of port devices:
Full-Speed devices — operates in 12 Mb/s Low-Speed devices that work in 1.5 Mb/s
The STF202 device can be shaped to be used for either Full-Speed or Low-Speed devices which is achieved as described below:
Full-Speed Devices
The Pull up resistor (Rpu) is connected to the D+ Line. The terminal 1 is connected to the Voltage Supply Line (Vgus) while the terminal 6 is connected to ground. The input of the D+ line is connected in the terminal 3 which outputs from the terminal 4. Finally, the input of the D- line is connected in the terminal 2 which outputs from the terminal 5. The Figure 8 shows the connections of the STF202 device for “Full-Speed devices”.
USB [e) Controller
Peripheral
STF202 D-
Figure 8.
Low-Speed Devices
The Pull up resistor (Rpu) is connected to the D- Line. The terminal 1 is connected to the Voltage Supply Line (Vgus) while the terminal 6 is connected to ground. The input of the D- line is connected in the terminal 3 which outputs from the terminal 4. Finally, the input of the D+ line is connected in the terminal 2 which outputs from the terminal 5. The Figure 9 shows the connections of the STF202 device for “Low-Speed devices”.
Peripheral USB [e) Controller STF202 Figure 9.
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STF202-22T1G
The Figure 10 describes in a simplified way what the USB port components are. As shown in this diagram, there are signals for upstream and downstream ports which must be provided with Line Termination and EMI Filtering to meet the requirements of the USB specification revision 1.1. In
CLK CRISTAL
REGULATOR
addition to the Line termination and EMI Filtering, it is also needed to protect the USB I/O Lines against ESD conditions, so TVS devices must be added for these purposes.
To | <——| DPO DP1-DP4 D+ Upstream Ports | «——»| pmo DM1-DM4 = D- USB Data Lines
0C1-O0C4
PWR1-PWR4
and Power to Downstream Veus Ports POWER SWITCHING
GND
Figure 10.
As mentioned before, the ON Semiconductor STF202 device provides “upstream termination”, EMI Filtering and ESD Protection to IEC61000-4—2 in an integrated solution
DOWNSTREAM TERMINATION
ae POWER cf switch |_| |_|
placed in a small and single package (TSOP-6, Case 318G). The typical application for the STF202 device is shown in the Figure 11.
Veus DOWNSTREAM Tvs al TERMINATION | ws [4 GND USB CONTROLLER Figure 11.
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STF202-22T1G
PACKAGE DIMENSIONS TSOP-6 CASE 318G-02 ISSUE V D—> ) DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. H 2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
L2 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, GAUGE PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR - PLANE GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
Lhe M SEATING MILLIMETERS
C) BLANE pim[ MIN | Nom | MAX
DETAIL Z A_| 0.90 1.00 1.10
Ai 0.01 0.06. 0.10 b 0.25 0.38 0.50 c 0.10 0.18 0.26
c ~ Dp | 290 | 3.00 | 3.10 sTes: E | 250 | 275 | 3.00 : QQ] 0.05 { A LS ( LL) E1| 130 | 150 | 170 PNY D- 7 r f y e | 085 | 095 | 1.05 3. Din)s At L_| 0.20 | 040 | 0.60 4. Dfou)+ DETAILZ L2 0.25 BSC 5. D(out)- Mo = 18 6. GND RECOMMENDED SOLDERING FOOTPRINT* 6x —> ~— 0.60 3.20 6x c 0.95 it T
T | k-o95
PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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STF202-22T1